Specifications:
| Product Name | Chip Underfill |
| Model | UF6008 |
| Brand | JCID |
| Storage conditions | keep stored in cool places at room temperature |
| Made for | Nand CPU packaging |
Features:
JCID UF6008 Chip Underfill is a highly reliable and efficient solution for Nand CPU packaging. With its exceptional features, including rapid and even diffusion, automatic curing, softening under high temperatures. And superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device. Make your maintenance work more professional and reliable.


شابلون آیسی برند AMAOE











